Patent Information

Patent Information

Patent application status

No

Patent Name

Application Number

Application Country

1

Method for manufacturing multi layer PCB

2013-0165695

Korea

2

Carbon coating liquid for mlb and manufacturing method for mlb thereof

2013-0165696

Korea

3

Method for manufacturing multi layer PCB

2013-0165697

Korea

4

Method for manufacturing multi layer PCB

2013-0165698

Korea

5

Plating method for manufacturing multi layer PCB

2014-0059523

Korea

6

Electroless copper plating method for manufacturing multi layer pcb using ion palladium catalyst

10-2014-0152641

Korea

7

Fiber Electroless Copper Plating Process

10-2016-0032692

Korea

8

Fiber Electroless Copper Plating Process

10-2016-0032692

Korea

9

Fiber plating method using electroless copper plating method

10-2018-0076290

Korea

10

Method for electroless copper plating through-hole of printed circuit board and method for preparing a catalytic
solution used in method thereof

2016-228300

Japan

11

Method for electroless copper plating through-hole of printed circuit board and method for preparing a catalytic
solution used in method thereof

201710041299.9

China

12

Method for electroless copper plating through-hole of printed circuit board and method for preparing a catalytic
solution used in method thereof

106103197

Taiwan

13

Method for electroless copper plating through-hole of printed circuit board and method for preparing a catalytic
solution used in method thereof

21358

Vietnam